How A Computer PROCESSOR Is Made (Intel Shows )

Sand. Comprises 25 percent of the silicon, after oxygen, the second most abundant chemical element in the earth’s crust. Sand, especially quartz, has high silicon ratios in the form of silicon dioxide (SiO2) which is the main component of semiconductor manufacturing.

After the purchase of raw sand and the separation of silicon, the excess material is disposed of and they purify the silicon in multiple steps finally reach the quality of semiconductor manufacturing called silicon electronic. The resulting purity is so great that electronic silicon may have only one peculiar atom per billion silicon atoms. After the disinfection, silicon enters the solubility stage. In this picture, you can see how one large crystal implanted from the melting of purified silicon. They call the crystal a mono crystal line alloy.

They produce a mono-crystalline alloy from electronic silicon. One alloy weighs about 100 kg (or 220 lbs) and has a silicon purity of 99.9999%. The alloys then transferred to the cutting stage where the individual silicon slices, called the chips, sliced into thin strips. Some alloys can stand above five feet. There are several diameters of alloy depending on the size of biscuits required. Today, C.P.Us are typically made on 300 mm chips.

Once cut, they trim the chips to provide flawless reflective surfaces. Intel does not produce its own alloys and chips and instead buys ready-made chips for manufacturing from other companies. The advanced Intel High-K / Metal Gate process uses 45 mm of 300 mm (or 12 inches) chips. When Intel produced potato chips, it printed circuits on 50 mm (2 inches) chips. These days, Intel uses 300 mm chips, resulting in lower costs per chip. The blue liquid, they filmed which above, is an image that resists finishing similar to that used in photography. The biscuits rotate during this step to allow an evenly distributed layer to be smooth and very thin.

At this stage, they expose photo-resistant coatings to ultraviolet light. The chemical reaction from ultraviolet light is like what happens to film materials in the camera at the moment of pressing the shutter button. The resistance areas on the exposed to ultraviolet radiation will become soluble. When used with ultraviolet light, masks create different circuit patterns. The CPU rebuilds this process repeatedly until they stack multiple layers on top of each other. The lens (center) reduces the mask image to a small focal point. The resulting “print” is usually four times smaller, linearly than the mask style.

In the picture, we have a representation of what the transistor will look like if we can see it with the naked eye. The transistor works as a switch to control the flow of power in a computer chip. Intel researchers have developed so small transistors they claim nearly 30 million of them can placed on a pinhead.After exposure to ultraviolet light, the areas exposed to the blue exposed images completely dissolved by a solvent. This reveals the pattern of image resistance made by the mask. Starters of transistors, interfaces and other electrical connections grow from this point.

The image resistant layer protects the biscuit material that should not drilled. They will drill areas that have been exposed away with chemicals. After the pattern, they remove the image’s resistance, and the desired shape becomes visible.

More image resistance (blue) applied and then exposed to ultraviolet radiation. The exposed image then washed again before the next step, called ion-steroids. This is the step in which they expose the ion molecules to the chip, allowing the silicon to change its chemical properties in a way that allows the processor to control the flow of electricity. Through a process called ion implantation (a form of a process called doping),, they shell the exposed areas of the silicon chip with ions. They implant the ions in a silicon wafer to change the silicon method in these areas connected to the electricity. They charge the ions to the surface of the chip at very high speeds. The electric field speeds up ions faster than 300,000 km / hr (about 185,000 mph)

After the implantation of ions, the resistance of the images will removed, and the materials that should have drugged (green) now have strange atoms planted. This transistor is about to finish. They have drilled three holes into the insulation layer (magenta color) above the transistor. They will fill these three holes with copper, which will form bonds with other transistors. They place the chips in copper sulfate solution at this stage. They deposit copper ions on the transistor through a process called an electrode. Copper ions move from the anode to the cathode represented by the wafer.

The copper ions settle as a thin layer on the surface of the wafer. The excess material refined by leaving a thin layer of copper. They create multiple metal layers to connect (wires of thinking) between different transistors. How to “link” these connections determined by design and architecture teams that develop the functionality of the processor in question (for example, the Intel i7 Core processor). Although the computer chips look flat, they may already contain over 20 layers to form complex circuits. If you look at a larger view of the chip, you’ll see a complex network of circuit lines and transistors that look like a multi-layer future highway system.

They place this part of the finished chip through the first functional test. At this stage, the test patterns fed into every single chip and it compares the response from the monitored chip to the “correct answer”. After the tests determine that the chip has a good return for the working processor units, they cut the chip into pieces (called templates). The templates returned with the correct answer will be put on the test pattern for the next step (packaging). It ignores a bad death. Several years ago, Intel had kitchens out of the CPU dead. This is the individual die they have cut which in the previous step (partition). The template shown here is the death of the Intel Core i7 processor.

The substrate, die, and they put together the heat spreader to form a finished processor. The green substrate constructs the electrical and mechanical interface of the processor to interact with the rest of the computer system. The silver heater is a thermal interface where the cooling solution applied. This will keep the processor cool during playback. The microprocessor is the most complex product on Earth. In fact, it takes hundreds of steps, and only in this story. During this final test, they will test the processors for their main properties (among the characteristics that have tested are the power dissipation and the maximum frequency).

Based on the test result, they place testers of the same grade test capacity in the same transport trays. They call this process “binning”. Binning determines the maximum operating frequency in the processor, and the payments are split and sold to fixed specifications. Processed and tested processors (from the new Intel Core i7 processor here) appear either go to the system manufacturers in the drawers or to the retail stores in the box. Thanks so much to Intel for providing the text and images in this storyboard.